Epson Toyocom作为晶体元器件的业界领袖，通过寻求开发和提高实定时元器件，传感元器件及光学元器件产品系列，包括这些器件的复合模块为轴心的「3D 战略」，使公司业务得到持续增长。

	型号	封装	批号	数量
	SG-645PCP-25.000000	SMD	09+	18000
	SG-645PCP-14.320M	SMD	09+	18000
	SG-645PCG-24.0000M	SMD	09+	18000
	SG-645PCG-10.0000M	SMD	09+	18000
	SG-636SCE-4.000000M	SMD	09+	18000
	SG-636SCE-32.0000MH	SMD	09+	18000
	SG-636SCE-20.000M-C	SMD	09+	18000
	SG-636SCE-16.666MHZ	SMD	09+	18000
	SG-636PTF-16.0000M	SMD	09+	18000
	SG-636PTF-12.288MH	SMD	09+	18000
	SG-636PTF-7.372800M	SMD	09+	18000
	SG-636PTF-7.0656MHZ	SMD	09+	18000
	SG-636PTF-36.0000MH	SMD	09+	18000
	SG-636PTF-36.0000M	SMD	09+	18000
	SG-636PTF-32.000MHZ	SMD	09+	18000
	SG-636PTF-24.5760MH	SMD	09+	18000
	SG-636PH-66.666000	SMD	09+	18000
	SG-636PH-60.000000	SMD	09+	18000
	SG-636PCW-59.13494	SMD	09+	18000
	SG-636PCV-66.666700	SMD	09+	18000
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